Nov 22, 2025
Glass technologies combine the advantages of organic and silicon substrates and, though supply chains are not yet fully developed, they have been used to create a variety of RF components, packages,
Oct 10, 2025
Kyocera provides a wide range of components for optoelectronics and optical communications modules, including packages, submounts, and lids.
Feb 16, 2026
Enhance your optical communication systems with our high-performance Ceramic Substrates, specifically designed for optical communication modules. Our substrates offer exceptional thermal
May 24, 2026
Jian Yang and ZiliangWang Abstract Low temperature co-fired ceramic (LTCC) is a very promising and con-tinually evolving substrate technology, which has been widely used in wireless communications,
Sep 29, 2025
Innovacera is dedicated to providing stable, reliable, and customizable aluminum nitride ceramic substrate solutions for the optical communication
Dec 16, 2025
In CPO architectures, optical engines are placed extremely close to switch ASICs, drastically reducing power consumption and latency. This demands substrate materials with exceptional thermal
Jun 15, 2026
Design and Fabrication of a Ceramic Substrate-Embedded SiC Power Module Abstract: Embedded packaging of wide-bandgap (WBG) power modules offers an inherently lower parasitic inductance,
Mar 30, 2026
From AI accelerators and high-bandwidth memory (HBM) packaging to ultra-high-speed optical modules and power semiconductor devices, ceramic substrates are now recognized as one of the key
Nov 20, 2025
In early applications, aluminum oxide (Al2O3) ceramic substrates, thanks to their mature manufacturing processes and cost advantages, have been widely used in medium- and low-speed
Apr 13, 2026
This section introduces Kyocera''s ceramic substrates and packages, fiber optic communication module components, optical fiber connection components, and more, by product categories.
Jul 31, 2025
Aluminum nitride (AlN) is one of the most thermally conductive ceramic materials. In optical communication modules, the trend toward greater miniaturization and
Nov 02, 2025
High-performance aluminum nitride ceramic heat dissipation substrates are now crucial materials for high-end optical modules, thanks to their
Aug 22, 2025
Features Substrate with optical waveguides for high-density optical transmission based on SHINKO organic substrate technologies SHINKO Optical Polymer Waveguide supports single-mode
Feb 04, 2026
The Ceramic Substrate Market worth USD 6.88 billion in 2026 is growing at a CAGR of 6.54% to reach USD 9.44 billion by 2031. CoorsTek Inc.,
Oct 04, 2025
The secret behind it is a ceramic substrate which enables wide-band gap semiconductor, VCSEL and LED manufacturers to design their products smaller
Apr 25, 2026
Kyocera provides ceramic substrates and packages, fiber optic communication module components, optical fiber connection components, and more.
Jun 08, 2026
Innovacera is committed to delivering stable, reliable, and customizable AlN ceramic substrate solutions for the optical communications
Oct 09, 2025
A comparison study for metalized ceramic substrate technologies: For high power module applications //2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference
Mar 27, 2026
This presentation gives a wide and comprehensive overview of today''s ceramic substrate technologies used in microelectronic packaging.
Feb 19, 2026
Due to its excellent thermal conductivity and electrical insulation properties, aluminum nitride (AlN) ceramic substrates are emerging as a critical material choice for high-speed optical
Sep 16, 2025
In the 5G era, the demand for high-bandwidth computing, transmission, and storage has led to the development of optoelectronic
Nov 04, 2025
Active interposers and intelligent substrates As interposers and substrates evolve from passive routing layers to intelligent system components,
Mar 25, 2026
Abstract High heat conductivity and high heat capacity make ceramic substrates indispensable to the manufacture of Multi-Chip Modules (MCM) and power electronics. In this paper
Jan 28, 2026
Kyocera proposes an LTCC substrate for optical communication devices that utilize Si photonics technology.
May 24, 2026
Herein, we proposed a unique method that combines the preparation of ceramic sheets with copper circuits through the CSP method to create integrated ceramic circuit substrates suitable
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